| 摘要 |
<p>PURPOSE:To obtain a heat-resistant resin paste useful as an interlaminar insulating film or surface protecting film of IC, having thixotropic properties, comprising two kinds of organic liquids, heat-resistant resin soluble in the organic liquids and fine particles of heat-resistant resin soluble only in one of the liquids. CONSTITUTION:A heat-resistant resin paste comprising a mixed organic liquid comprising (A) an organic liquid (e.g. N-methylpyrrolidone) and (B) an organic liquid (e.g. diethylene glycol dimethyl ether) more volatile than the component A, (C) a heat-resistant resin (e.g. preferably polyamide resin) soluble in the mixed organic liquids and (D) fine particles of heat-resistant resin soluble in the component A but not in the component B, preferably polyamide or polyimide having <=40mum average particle diameter prepared by nonaqueous dispersion polymerization method, prepared by dispersing the component D into a solution containing the components A, B and C, having >=1.5 thixotropic coefficient. IC having an interlaminar insulating film or surface protecting film prepare from the paste.</p> |
