发明名称 |
Inductor and carrier suitable for attaching to a hybrid substrate or the like |
摘要 |
An inductor and carrier suitable for mounting on a mounting substrate includes an etched sheet of a bonded copper layer and polyimide film to form a film carrier. The periphery of the film carrier is patterned with a plurality of windows and a plurality of conductors, each conductor having a bent-up tab and and end portion terminating at the periphery within the respective window. A microminiature inductor core having a plurality of insulated windings is soldered to the respective bent-up tab of each conductor and the end portion of each conductor is then welded to bonding pads on the mounting substrate.
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申请公布号 |
US4967175(A) |
申请公布日期 |
1990.10.30 |
申请号 |
US19890435212 |
申请日期 |
1989.11.13 |
申请人 |
TEKTRONIX, INC. |
发明人 |
BERG, WILLIAM E.;LUEKER, JONATHAN C. |
分类号 |
H01F27/29;H05K1/14;H05K1/18;H05K3/32;H05K3/36 |
主分类号 |
H01F27/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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