发明名称 |
Printed circuit board for integrated circuits |
摘要 |
Known printed circuit boards consist of carrier plates which do not conduct heat and are not resistant to breaking. The object of the invention is to obtain a printed circuit board on which heat-dissipating components can be arranged close to one another, with it still being possible, however, to keep the temperature stable. At the same time, the printed circuit board is intended to be resistant to breaking. In the case of the printed circuit board, the carrier plate (1) consists of a heat-conducting metal plate (2), on the plate surface of which an electrically insulating layer (3) is located, as is diagrammatically represented in the single figure. The invention makes it possible to prepare flat components which are resistant to breaking and are stable with respect to temperature and can also be protected against radiological beams, electric fields, and the influence of moisture and the surroundings. <IMAGE>
|
申请公布号 |
DE3910699(A1) |
申请公布日期 |
1990.10.04 |
申请号 |
DE19893910699 |
申请日期 |
1989.04.03 |
申请人 |
O.M.T. OBERFLAECHEN-UND MATERIALTECHNOLOGIE GMBH, 2400 LUEBECK, DE |
发明人 |
REPENNING, C., DR., 2057 REINBEK, DE;YANNICOS, BASIL, 2410 MOELLN, DE |
分类号 |
H01L23/14;H05K1/02;H05K1/03;H05K1/05;H05K1/18 |
主分类号 |
H01L23/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|