| 摘要 |
PURPOSE:To improve interlayer insulating property, moisture resistance, heat resistance stress property, and the heat resistance stress property of a bump connection part, and reduce cost and mounting area by installing a buffer layer composed of insulating material on the upper surface of a semiconductor element and the upper surface of a printed board. CONSTITUTION:On a wiring pattern 1a formed on the upper surface of a printed board 1, a semiconductor element 2 is plane-mounted by gang bonding; sealing resin 4 is arranged so as to surround the plane-mounted semiconductor element 2, and seals the element. In this mounting method of a semiconductor element, on the upper surface of the semiconductor element 2 and the upper surface of the printed board 1, a buffer layer 6 composed of insulating material, whose thermal expansion coefficient is an intermediate value between those of the semiconductor element 2 and the printed board 1 and that of the sealing resin 4, is formed; via the buffer layer 6, sealing is performed by using the sealing resin 4. For example, contractive resin 4a is inserted between the printed board 1 and the semiconductor element 2, and a heat dissipating metal thin film 7 corresponding with a part, whose heating value is large in the semiconductor element 2, is formed on the buffer layer 6.
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