| 摘要 |
Propagation of electromagnetic interference waves is eliminated or substantially reduced by providing an electromagnetic interference shield suitable for shielding electromagnetic interference or radio frequency interference which are generated by offending components on a monolithic integrated circuit chip. The shield is disposed over the offending components of the integrated circuit and is sufficiently large to eliminate or substantially reduce the propagation of any offending interference waves. Alternatively, the shield may be disposed over a non-offending component to prevent radiated electromagnetic interference from entering the non-offending component. The shield is electrically conductive and maintained at a predetermined, primarily constant, electrical potential with respect to the underlying integrated circuit chip. The shield is integral with the electrically conductive tape used with tape automated bonding manufacturing techniques, or, in an alternative embodiment, the flexible conductive circuitry pattern used with flexible circuitry manufacturing techniques.
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