| 摘要 |
PURPOSE:To prevent development of static electricity and to prevent a circuit element from being damaged by attaching a protective adhesive tape provided with a conductive layer grounded, to a circuit pattern formation surface of a semiconductor wafer which is held to a grounded table. CONSTITUTION:A semiconductor wafer 1 which is provided with a circuit pattern is sucked and held onto a grounded conductive table 2 with its circuit pattern formation surface upward. A protective adhesive tape 3 which is made by inserting a conductive layer 3c consisting of a metal thin layer between an insulating base film 3a and an adhesive layer 3b is attached to a circuit pattern formation surface of the semiconductor wafer 1. A grounded conductive roller 9 which is provided with a group of projections 8 at an outer periphery thereof, which come into contact with the conductive layer 3c through the adhesive layer 3b, operates on the protective adhesive tape 3 and an earth line makes static electricity charged in the protective adhesive tape 3 escape. The protective adhesive tape 3 and the semiconductor wafer 1 are made to the same electric potential to prevent breakdown due to static electricity of a circuit element.
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