| 发明名称 |
Thermoforming of laminated structures. |
| 摘要 |
<p>Vacuum thermoforming of laminated structures is achieved by perforating all layers (33, 35) to be formed except the layer outermost (31) from the mold (11). Thus, the non-perforated layer (31) is attracted to the mold (11), serving as a diaphragm for the other layers or consolidating therewith to form the desired article.</p> |
| 申请公布号 |
EP0369207(A1) |
申请公布日期 |
1990.05.23 |
| 申请号 |
EP19890119636 |
申请日期 |
1989.10.23 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
LEE, WALTER J.;HISSEM, CATHERINE SUE |
| 分类号 |
B29C51/10;B29C51/14;B29C51/28;B29K67/00;B29L9/00;B29L22/00;B32B1/02;B32B3/24;B32B27/36;B32B43/00 |
主分类号 |
B29C51/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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