摘要 |
In the case of this electronics module, the ceramic material is burnt, in the green state, together with a thick-film paste which is resistant to high temperatures and is suitable for carrying current. In order to create electronics modules in the case of which no cable harnesses, soldering legs or spacers need be used, the ceramic material is given a desired three-dimensional shape before the sintering process but after the conductor track structure has been printed by means of thick-film paste. The ceramic material can, for example, be bent over an edge or over a metal core, or can be rolled over a cylinder. Two ceramic modules (4a, 4b) which are bent in a U-shape, and two two-dimensional ceramic modules (7a, 7b) can be assembled to form a box-shaped double ceramic module (6), the conductor tracks of the individual ceramic modules being at least partially connected to one another. <IMAGE>
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申请人 |
ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE |
发明人 |
KROKOSZINSKI, HANS-JOACHIM, DIPL.-PHYS. DR., 6907 NUSSLOCH, DE |