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发明名称
VERFAHREN UND VORRICHTUNG ZUM BEFESTIGEN VON HALBLEITERCHIPS AUF EINEM TRAEGERELEMENT
摘要
申请公布号
DD278006(A1)
申请公布日期
1990.04.18
申请号
DD19880323113
申请日期
1988.12.14
申请人
VEB MIKROELEKTRONIK "WILHELM PIECK" MUEHLHAUSEN,DD
发明人
BORN,ANDREAS,DD;NIEMANN,KLAUS,DD;KUSCH,RUEDIGER,DD
分类号
H01L21/58;(IPC1-7):H01L21/58
主分类号
H01L21/58
代理机构
代理人
主权项
地址
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