| 摘要 |
There is disclosed a family of low dielectric, copper-exuding, boroaluminosilicate glasses particularly adapted to use in forming substrates for electronic devices such as integrated circuits. The glasses are capable of exuding copper oxide, have a coefficient of thermal expansion of 30-35x10-7 at 300 DEG C., a dielectric constant not over 5.0 at 100 KHz, a loss tangent not over 0.003 at 100 KHz and consist essentially, in percent by weight, of 56-64% SiO218-25% B2O3, 3-11% Al2O3, 0-2% CaO, 0-2% Li2O, 0-1% K2O, the Li2O+K2O+CaO being 1.5-3% and 1-20% CuO.
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