RESIN SEAL FORMING APPARATUS FOR SEALED COMPONENT WITH LEAD,申请号JP19880163878-传众专利搜索

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发明名称	RESIN SEAL FORMING APPARATUS FOR SEALED COMPONENT WITH LEAD
摘要
申请公布号	JPH0212720(A)	申请公布日期	1990.01.17
申请号	JP19880163878	申请日期	1988.06.30
申请人	CKD CORP	发明人	OGAWA YUKIHIKO;YAMADA KATSUMI;KATO MASAHIRO
分类号	H01H37/76;H01H11/00	主分类号	H01H37/76
代理机构		代理人
主权项
地址

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