Silicone gel electronic device encapsulant

摘要

An article of manufacture comprising an electron device encapsulated by a silicone resin material consisting essentially of 15 to 30 weight percent of polydimethylsiloxane and/or polymethylphenylsiloxane resin including a platinum catalyst, 50 to 80 weight percent of silicon dioxide and 5 to 20 weight percent of a silicon hydride.