METHOD OF SEALING ELECTRONIC COMPONENT WITH RESIN,申请号JP19880129617-传众专利搜索

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发明名称	METHOD OF SEALING ELECTRONIC COMPONENT WITH RESIN
摘要
申请公布号	JPH01298728(A)	申请公布日期	1989.12.01
申请号	JP19880129617	申请日期	1988.05.27
申请人	MURATA MFG CO LTD	发明人	TAKAGI KIYOSHI
分类号	B05D1/28;H01L21/56	主分类号	B05D1/28
代理机构		代理人
主权项
地址

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