| 摘要 |
PURPOSE:To rapidly cool the body to be worked and to prevent coarsening of the crystal grains of solder by equipping a liquid coolant feeding means feeding to the body to be worked the liquid cooling the body to be worked after completion of soldering. CONSTITUTION:The vapor generated by boiling the heat medium 3 for reflowing by heating it by a heater 1 rises in a vapor tank 2, is cooled by a vapor tank cooler 4 and returns to the vapor tank by its liquefaction. One part of the vapor is flowed toward the inlet port 9 and outlet port 8 of the body to be worked and recovered by liquefying it by cooling by the coolers 11, 12 of the inlet port side and outlet port side. The body 10 to be worked sticking an electronic component 13a, etc., by a solder paste is placed on a belt conveyor and carried into the vapor tank 2, then the vapor of the heat medium 3 for reflowing is brought into contact with the surface of the body 10 to be worked. The solder paste is melted by the heat of the heat medium 3 and the body 10 to be worked coming out of the vapor tank 2 is rapidly solidified by cooling by the coolant of a coolant feeding means 5. The coarsening of the crystal grain of a solder is thus prevented and a soldering part excellent in a mechanical property is obtd. |
