| 摘要 |
PURPOSE:To realize improvement of yield, reduction of manufacturing cost and an increase of design freedom by causing a flexible circuit to adhere so that a hollow part is formed, and then forming a resin filling part. CONSTITUTION:To begin with, a flexible circuit 25 is manufactured. In the meantime, a flat plate-like vertical substrate 37 with the dimensions of a heat generating element 17 which constitutes a flexible circuit 25 and a thickness corresponding to equipment design, is prepared. Then an adhesive is applied to the side 41 of the substrate. After that, the position of the heat generating element constituting the flexible circuit 25 is registered in such a manner that said element 17 is arranged on an end 39, and the flexible circuit 25 is curved into a loop and caused to adhere to the end. Next, organic synthetic resin which is heat-resistant and also heat-curing is adjusted to a specified viscosity, and a resin-filling part 47 with a hollow part 45 filled is formed in a plastic condition. This resin is cured on specified curing conditions to form a resin part 49. |
