| 摘要 |
PURPOSE:To prevent dust gathering because of resist's sticking to the side of wafer, by covering the effective area of the wafer and dissolving only an unnecessary part of the resist as well while discharging fresh air. CONSTITUTION:After supporting a wafer 31 coated by a resist by a wafer chuck 32 in a vacuum, its wafer is rotated. A circular cover 33 is mounted to cover the effective area of the wafer in such a way as to allow its height of the cover not to be in contact with the top part of the wafer which is held in a rotating state. Further, a fresh air discharging band 34 is installed at the outer circumference of the cover 33 so as to discharge fresh air a in the direction of end faces of the wafer. And a light b is irradiated to expose the side part of the wafer to light by a sensitization light source 35 to dissolve (develop) the resist. Then a treating liquid c where the exposed resist is dissolved is discharged from the lower part of the wafer through a treating liquid discharge port and the resist a,t the side of the wafer is removed by dissolving it. The flow of fresh air which is discharged from the fresh air discharging band 34 at the outer circumference of the cover prevents the entrance of the treating liquid into the effective wafer area. |
