| 摘要 |
PURPOSE:To assure an enamel substrate for an electronic circuit with uniform coating by providing at least one metal thin layer between a copper or copper series alloy layer. CONSTITUTION:Thin metal layers 5, 6 are provided between copper or copper series alloy layers 3, 4 and enamel layers 9, 10, thereby preventing an oxide layer from being produced. In addition, copper is oxidized in baking (800-900 deg.C) upon formation of an enamel layer, and copper oxide so produced is prevented from entering the enamel layer to keep insulating voltage high. For constitutent metals of the thin metal layers 5, 6, any metal or alloy will do if it could prevent an oxide layer from being produced on the copper or copper series alloy layers 3, 4, the metal or alloy hereby demonstrating clear effect in particular. Additionally, said constituent metal may be selected from at least any one from Ni, Ni-Sn alloy, NiP alloy, Co, Co-Sn alloy, Ti, Ti series alloy, all being excellent in an adhesion (joint) property with enamel. Still more, for the thin metal layer formed on the copper or copper series alloy layer, two or more layers may be provided at need without limitation to a single layer. |
