| 摘要 |
PURPOSE:To always surely, easily and directly connect a wire to the surface of a wire bonding area by a direct bonding operation by a method wherein silver is plated to be extremely thin on the surface of the wire bonding area where at least a copper substratum of a lead frame is exposed so that the formation of a copper oxide film can be prevented. CONSTITUTION:Silver is plated to be extremely thin on the surface of wire bonding areas 2a where a copper substratum of a lead frame 1 is exposed. Accordingly, when the lead frame 1 is transferred or transported, or when a semiconductor chip is fixed to an upper face of a die pad 7 of the lead frame 1 by a heating operation, a copper oxide film is hardly formed on the surface of the wire bonding areas 2a where the copper substratum of the lead frame 1 is exposed. By this setup, it is possible to always surely, easily and directly connect wires 31 to the surface of the wire bonding areas 2a of the lead frame 1 by a direct bonding operation. |
