| 摘要 |
PURPOSE:To regenerate rejected products of printed circuit board by a method wherein the copper adhered on a rejected circuit board is dipped in an ammonium persulfate aqueous solution to be removed, and after being naturally dried, an adhesive layer is roughened. CONSTITUTION:A defective substrate is dipped in an ammonium persulfate aqueous solution to completely remove electrolessly plated copper and washed with water. Then, the whole surface of the substrate is smoothed with an automatic surface conditioning equipment using polishing powder, an adhesives layer 2 is cleaned, and left to stand to be naturally dried after being washed with water. The substrate is dipped in a surface roughing liquid for the time less than normal dipping time to rough the adhesives later 2. The sodium dichromate adhering on the surface of the substrate is reduced to be removed, and dipped in an electroless copper plating liquid after being washed with water to deposit the primary copper on the whole surface of the substrate. The substrate is subjected to reverse-printing to print a desired circuit. After the reverse-printed ink 4 is removed, the primary copper 3 other than that on the circuit is removed with etching to form a printed circuit, thereby the regeneration of rejected products of printed circuit boards is realized.
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