| 摘要 |
PURPOSE:To prevent the peeling of an epoxy resin system adhesive on the surface of a heat-resistant insulating substrate by a method wherein a phenol resin layer containing epoxy resin having the same linear expansion coefficient as that of the heat-resistant insulating substrate is put between the heat-resistant insulating substrate and the epoxy system adhesive. CONSTITUTION:Phenol resin having the liner expansion coefficient 5X10<-6>/ deg.C that is relatively near that of a ceramic substratel is mixed with epoxy resin whose linear expansion coefficient is larger than that. A phenol resin layer 4 containing epoxy resin whose linear expansion coefficient as a whole is matched to the linear expansion coefficient 7X10<-6>/ deg.C is provided between the ceramic substrate 1 and the epoxy resin adhesive 2. In this case, the expansion coefficients of the phenol resin layer 4 containing epoxy resin and the epoxy resin adhesive 2 are different, however, they are the same epoxy resin with strong chemical affinity and adhesive power without producing interlayer peeling. Thus, even if the operating temperature is increased, there is no peeling occurring between the ceramic substrate 1 and the phenol resin layer 4 containing epoxy resin, achieving a stable die bonding of semiconductor chips. |
