| 摘要 |
PURPOSE:To provide an electroless copper plating device which eliminates the clogging in the forward end of an introducing pipe for replenishing liquid, by supplying the replenishing liquid intermittently from said introducing pipe into a plating cell provided with a circulation pipe, and flowing a gas into said introducing pipe thereby removing the plating soln. remaining therein. CONSTITUTION:Replenishing liquid is intermittently supplied from a tank 8 for replenishing liquid through an introducing pipe 6 for replenishing liquid into a plating cell provided with a circulation pipe 2, whereby electroless copper plating is continuously accomplished. An oxidative gas such as air is admitted by an air pump 15 into the pipe 6 to remove the replenishing liquid remaining in the pipe 6. The static boundary of the replenishing liquid and the plating liquid is eliminated by the above-mentioned mechanism, and the local runaway reaction in the forward end part of the pipe 6 is eliminated and the clogging in said part is eliminated. the stability of the liquid is thus improved. |
