| 摘要 |
PURPOSE:To obtain the titled adhesive suitable for use in electronic parts such as printed boards and connectors, by dispersing an adhesive substrate consisting mainly of polymer with hollow microspheres consisting of electrical insulation material. CONSTITUTION:The objective adhesive can be obtained by dispersing (A) an adhesive substrate consisting mainly of synthetic resin such as epoxy, polyester, acrylic or polyurethane resin or rubber such as silicone rubber or fluororubber with (B) hollow microspheres with a size of pref. 1-300mum, consisting of electrical insulation material such as glass or plastics. In case a reaction-curving type resin such as epoxy resin is used as the component A, glass-based microspheres are pref. used as the component B.
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