Soldering method using localized heat source,申请号US19870135183-传众专利搜索

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发明名称	Soldering method using localized heat source
摘要
申请公布号	US4785156(A)	申请公布日期	1988.11.15
申请号	US19870135183	申请日期	1987.12.18
申请人	AMERICAN TELEPHONE AND TELEGRAPH COMPANY	发明人	BENKO, JOHN W.;COUCOULAS, ALEXANDER
分类号	B23K1/005;B23K26/06;B29C35/08;B29C65/24;H01L21/60;H05K3/34;(IPC1-7):B23K26/00	主分类号	B23K1/005
代理机构		代理人
主权项
地址

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