| 摘要 |
PURPOSE:To realize a solid-state image pickup device in a thin-plate form, to make the accuracy of bonding alignment and the bonding distribution uniform, to prevent a foreign substance from being mixed and attached and to prevent the occurrence of damage to a photodiode and a color filter layer by a method wherein, after a monochromatic filter or a color- separating filter has been aligned with the solid-state imaging device and has been fixed, a transparent glass substrate is removed. CONSTITUTION:Chip-like color-separating filters 2 are formed on a transparent glass substrate 1; in addition, a protective film layer 3 is formed on the transparent glass substrate 1 and the color-separating filters 2. Then, light-receiving parts 6 at a wafer 5 for a solid-state imaging device are bonded and fixed on the protective film layer 3 through a bonded resin layer 4 and a bonded resin material 4' by means of an aligner in such a way that they are aligned with the respective color-separating filters 2. Then, the substrate 1 is etched, and the transparent glass substrate 1 is removed completely. During this process, the side of the wafer 5 for the solid-state image pickup device is kept protected in such a way that the side does not come into contact with an etching solution. As a result, the color-separating filters 2 remain on the side of the protective film layer 3; the color-separating filters 2 are exposed and are united to the wafer 5 for the solid-state image pickup device through the bonded resin layer 4 and the protective film layer 3. Then, the assembly is cut by means of a dicing saw and is processed. |
