发明名称 RESIN COMPOSITION FOR ELECTRICAL LAMINATE
摘要 PURPOSE:To obtain the title composition excellent in electrical properties, mechanical properties and punching quality, by mixing a specified curable prepolymer with a crosslinking vinyl monomer. CONSTITUTION:A polymer (a) having a hydroxyl group in the side chain is reacted with an unsaturated isocyanate (b) having a free isocyanate group and a (meth)acryloyl group in the molecule to obtain a curable prepolymer (A) in which the main chain is a polymer obtained by vinyl polymerization and the side chain has a (meth)acryloyl group bonded to the main chain through two urethane bonds, represented by the formula [wherein A is the main chain part of a random copolymer, MW of 10,000-100,000, of a vinyl monomer with a (meth)acryloyl monomer, R is H or methyl and X1-2 are 2-16C hydrocarbon groups which may be bonded together through an ether bond, provided that the carbon bonded to the oxygen in X1 and X2 is primary or secondaryl]. 10-60wt% component A is mixed with 90-40wt% crosslinking vinyl monomer (B) (e.g., styrene) to obtain a resin composition used to form a resin composition for electrical laminates.
申请公布号 JPS63120713(A) 申请公布日期 1988.05.25
申请号 JP19860266129 申请日期 1986.11.07
申请人 SHOWA HIGHPOLYMER CO LTD;SHOWA DENKO KK 发明人 OGURA TATESHI;HARIGAI NORITAMA;MATSUI FUMIO;SUZUKI NOBORU;TAKAISHI MINORU
分类号 H01B17/60;C08F265/00;C08F290/00;C08F299/02 主分类号 H01B17/60
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