| 摘要 |
PURPOSE:To carry out various kinds of platings with high efficiency by successively receiving almost flat punched articles by a mask body corresponding to each plating area, and charging a plating soln. from the mask opening formed on each mask body. CONSTITUTION:When a first plating area A1 around the island part of an IC lead frame is plated, the first plating area A1 is engaged with a first mask body 8 and supported. The first mask body 8 has a first mask opening 13 in the shape corresponding to the first plating area A1, and also has a first replica- shaped part 17 provided with recesses 14 receiving the plane region H other than the first plating area A1 and masking the region and protrusions 16 entering the punched cavities 15 and masking the side region S other than the first plating area A1. As a result, only the first plating area A1 can be accurately plated through the first mask opening 13. Besides, the second plating area of the pin part of the IC lead frame can be plated in the same way.
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