SEMICONDUCTOR MANUFACTURING EQUIPMENT

摘要

PURPOSE:To enable the overall surface of a wafer to be coated with resist easily by a method wherein multiple resist dripping pores are arranged on a coating region formed after the configuration of wafer. CONSTITUTION:An unbrella type hollow resist dispenser sheet (b) is assembled into a funnel type shell (a) while the configuration of bottom 7a of dispenser sheet is made almost similar to that of wafer 4 and multiple pores (c) (dripping pores) are arranged on overall surface of the resist dispenser sheet. Resist is dispensed by the dispenser sheet to be dripped on the wafer 4 through multiple pores for coating in specified film thickness by low or high speed revolution. Through these procedures, overall surface of wafer 4 can be evenly coated with photoresist even if the photoresist is hardly spread due to notable irragularities or surface properties of wafer pattern.