| 摘要 |
PURPOSE:To reduce the cost of a carrier tape and obtain parallelism by means of a bonding machine easily by a method wherein conductive paste is attached to the front surfaces of bumps formed on the top surface of a semiconductor chip or to the rear surfaces of base ends of leads, and the bumps and the leads are bonded together by the adhesive force of the conductive paste. CONSTITUTION:Pads 2 made of conductive material such as aluminum are formed on both side edges on the top surface of a semiconductor chip 1 and three-layer bimetals composed of chrome/steel/gold or titanium/tungsten/gold are evaporated on the pads 2 and gold plating is applied to the bimetals to form bumps 3. Conductive paste layers 5 made of conductive paste which is usually used in semiconductor devices are provided between the front surfaces of the bumps 3 and the rear surfaces of the base ends if leads 4 and the bumps 3 and the leads 4 are bonded together by the conductive paste layer 5. With this constitution, bonding at the lower temperature and under the lower load can be realized and creation of bonding strain can be fully suppressed by the viscosity of the conductive paste and the alignment can be performed easily.
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