发明名称 PACKAGING APPARATUS FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To readily inspect characteristics of an electronic component without separating a taping by providing a testing hole to which characteristic testing component of the electronic component is inserted at least one of tapes covered in a sandwich state. CONSTITUTION:A testing hole 8 is formed at the opposed position of a chip type component 1 of a surface covering tape 7 to an electrode 2. A rear surface covering tape 6 is bonded to the rear surface of a cardboard 3, and a bottom of the tape 6 is formed in a punched hole 4, the component 1 is inserted into the hole 4 to bond the bottom to the tape 6, and a surface covering tape 7 is bonded to the front surface of the cardboard 3. When testing the characteristics of the component 1, the characteristic testing component is inserted into the hole 8 to be connected with the electrode 2 of the component 1 to be readily tested.
申请公布号 JPS62252144(A) 申请公布日期 1987.11.02
申请号 JP19860094479 申请日期 1986.04.25
申请人 HITACHI LTD 发明人 NOBUSAWA KOICHI
分类号 H01L21/66;B65D73/02;G01R31/26;H01L23/00 主分类号 H01L21/66
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