| 摘要 |
PURPOSE:To prevent the generation of bent, breakage and so on of a semiconductor element in the drying process for a surface protective agent by a method wherein the hardness of the element is set in such a way as to show a specific value or more after the surface protective agent is dried. CONSTITUTION:The hardness of a surface protective layer 4 of a columnar laminated material 10 consisting of semiconductor pieces 1 laminated through soft solders is set at 1H or more at pencil hardness when a surface protective agent is cooled at 180 deg.C or less after being dried. Thereby, even though solder layers 2 are softened at the time of a drying process of at least 180 deg.C, it is eliminated that the laminated material 10 is broken or curved and the manufacturing yield of a laminated semiconductor device like a high-pressure diode can be improved. |
