发明名称 IC ACCOMMODATION SLEEVE STACKING DEVICE
摘要 PURPOSE:To stack ICs quickly without given impacts by using a horizontal and a vertical moving member which cover two adjacent places, packing the ICs in an accommodation sleeve in the packing position, thereafter transporting the sleeve with ICs to the stacking position, and by performing the stacking in such a way as heaving from below. CONSTITUTION:A push member 25 protrudes in the stagnation position, and the other end of an empty accommodation sleeve 2 is put off from a step 25, when a fixing member 21 will also retract from the detained condition, so that it drops onto a vertical moving member 10 to be placed on a horizontal moving member 15, which carries horizontally sleeves 2 accommodated at a certain spacing. The member 15 will then stop, and the sleeves are set in the packing position 5 by said vertical moving member 10 again rising interlocked. When ICs 1 are fed in one after another to attain a specified amount, a detection signal actuates a vertical motion mechanism 13, and the sleeve 2 with ICs is transferred onto the horizontal moving member 15, when an empty sleeve 2 will be placed adjoiningly on the member 15. In linkage with sink of the vertical moving member 10, a horizontal motion mechanism 18 is actuated to move the two sleeves 2 to right under the stacking position 7 and packing position 6, respectively, followed by reactuation of the vertical motion mechanism 13 interlocked, which will lift the sleeve 2 with ICs up to the stacking position 7 without giving impacts.
申请公布号 JPS62161630(A) 申请公布日期 1987.07.17
申请号 JP19860003955 申请日期 1986.01.11
申请人 SANWA ELECTRON KK 发明人 KATSUMATA HIROSHI
分类号 H01L21/66;B65G57/30;B65G60/00;H01L21/67;H01L21/68;H05K13/00 主分类号 H01L21/66
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