| 摘要 |
PURPOSE:To obtain the titled low-m.p. glass paste capable of forming a semiconductor package of high value as a commodity and capable of obtaining a low-m. p. glass layer without any air bubbles and without being blackened by dispersing low-m.p. glass powder in a specified solvent contg. a polymerization inhibitor. CONSTITUTION:Low-m.p. glass powder is dispersed in a solvent obtained by mixing terpineol and >=0.1wt%, based on the terpineol, of a polymerization inhibitor (e.g., hydroquinone) to form the low-m.p. glass paste. Although a solvent contg. terpineol has been used heretofore, the solvent is changed in part by oxidative polymerization, etc., when dried and remains as the evaporation residue, the residue is decomposed in the glass when baked, hence air bubbles are generated, and the residue is carbonized to blacken the glass. A low-m.p. glass layer without any above-mentioned defects can be formed by mixing the polymerization inhibitor into the solvent. Consequently, a semiconductor package, etc., which are highly valuable as a commodity can be produced. |
