INTEGRATED CIRCUITS WITH CONTACT PADS IN A STANDARD ARRAY.

摘要

An integrated circuit chip (310) includes a top layer of dielectric (320) penetrated by conductive vias (305) connecting electrical contacts (304) within the integrated circuit proper to a network of electrical leads (326) disposed on top of the dielectric layer (320); the network of leads (326), in turn, being connected to an array of contact pads (330) adapted for simultaneous solder connection to a leadframe.