发明名称 |
Substrate for a semiconductor chip package and a method of fabricating the same |
摘要 |
A substrate for a semiconductor chip package comprises a metal layer characterized by a high coefficient of thermal conductivity and girded by a restraining wrapper characterized by both a low coefficient of thermal expansion and a high ultimate tensile strength.
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申请公布号 |
US4657797(A) |
申请公布日期 |
1987.04.14 |
申请号 |
US19850781592 |
申请日期 |
1985.09.30 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
NIED, HERMAN F. |
分类号 |
H01L23/13;H01L23/14;(IPC1-7):B32B5/16 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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