发明名称 |
Method for producing a multilayer ceramic circuit board |
摘要 |
A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of alpha -alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.
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申请公布号 |
US4642148(A) |
申请公布日期 |
1987.02.10 |
申请号 |
US19850738658 |
申请日期 |
1985.05.28 |
申请人 |
FUJITSU LIMITED |
发明人 |
KURIHARA, KAZUAKI;KAMEHARA, NOBUO;YOKOYAMA, HIROMITSU;OGAWA, HIROMI;YOKOUCHI, KISHIO;IMANAKA, YOSHIHIKO;NIWA, KOICHI |
分类号 |
C03C10/00;C04B35/14;C04B35/16;C04B35/18;C04B35/632;H01L21/48;H01L23/15;H05K1/03;H05K1/09;H05K3/46;(IPC1-7):B32B31/06 |
主分类号 |
C03C10/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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