| 发明名称 |
Process for forming a metallurgical system comprising a bottom layer of nickel and a top layer of gold. |
| 摘要 |
<p>The process comprises placing a nickel layer on the metallized portion of the substrate and then covering the nickel with an immersion layer of gold. The gold immersion layer is chemically stripped followed by depoiting thick gold over said nickel and diffusing said thick gold into said nickel. …<??>The process is particularly applied in making thermocompression bonds to a metallized ceramic substrate on which semiconductor chips are to be mounted and eletrically contacted.</p> |
| 申请公布号 |
EP0203423(A1) |
申请公布日期 |
1986.12.03 |
| 申请号 |
EP19860106186 |
申请日期 |
1986.05.06 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ADWALPALKER, AVINASH SRIPAD;HARVILCHUCK, JOSEPH MATTHEW;RANALLI, JOSEPH ROCCO;RICH, DAVID WILLIAM |
| 分类号 |
H01L21/3205;B23K20/233;B23K35/00;C04B41/52;C04B41/89;H01L21/48;H01L21/60;H01R43/16;H05K3/24;(IPC1-7):C04B41/90;C04B41/91 |
主分类号 |
H01L21/3205 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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