| 摘要 |
PURPOSE:To obtain a resin composition which can give a high-reliability resin- sealed semiconductor device, by mixing an epoxy resin with a specified curing agent and silicon nitride. CONSTITUTION:An epoxy resin composition comprising an epoxy resin (a), a curing agent (b) comprising a compound having at least two phenolic hydroxyl group in the molecule and silicon nitride (c). Preferable examples of the epoxy resins (a) are novolak epoxy resins of an epoxy equivalent of 170-300, such as phenol novolak epoxy resins and cresol novolak epoxy resins. As curing agents (b), novolak phenolic resins, phenol aralkyl resins, etc., are particularly preferable. Silicon nitride (c) is preferred to be in a form of, for example, powder, fiber or whisker.
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