SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To produce a semiconductor device with high reliability by a method wherein sheet type insulators protruding beyond peripheral part of a chip are stuck to the main surface of chip with electrodes while leads projecting from chip edges are stuck to main surface of chip to be connected to chip electrodes and covered with insulating package. CONSTITUTION:A chip 1 fitted with Al electrodes 6 on the main surface thereof is buried in a jig 10 with holes 9 made in array while Cu foil 11 is bonded to the chip 1 using epoxy 2 to be cured. Openings 4 are selectively made to screen-print and bake Ag paste 5 for connecting to the Cu foil 11. Firstly the Cu foil 11 is selectively etched to form leads 3 one side of which extends to the outside of peripheral edge. Secondly the assembled body is removed from the jig 10 to resin-seal 7 the chip 1 and inner ends of leads 3. Finally the resin 2 is cut off laterally and longitudinally to complete a semiconductor device 8. In such a constitution, the semiconductor device 8 with high reliability may be produced easily at high yield.