| 摘要 |
PURPOSE:To improve crack resistance property by chamfering the corner of approximately right angle of a chip placing unit disposed at a thin side of a resin package to lose the right angle portion, thereby weakening the concentration of a stress due to steam pressure. CONSTITUTION:A semiconductor device 10 has a semiconductor chip 12 enclosed by a molding insulating resin 11 represented by epoxy resin. The chip 12 is secured to a chip placing unit 13a of a lead frame 13, and connected by selected ones of a plurality of external leads 13b led from the resin 11 for forming a package and metal fine wirings. The corner disposed in the thin resin direction for forming the package of the side 14 of the unit 13a has a curved surface 15. This surface 15 is terminated at one end substantially at the center of the side 14, and slightly increased in the thickness t1 of the portion as designated by t4 to lose the right angle. |
