发明名称 Thermally insulative mounting with solid state device
摘要 A mounting for integrated circuit chips or solid state gas sensors, with superior thermal and electrical insulative properties. The mounting incorporates a tiny thin-wall glass capillary tube as the pedestal on which the chip or sensor is mounted. The glass tube holding the chip or sensor is then mounted on any base. A high temperature ceramic adhesive is used to hold the structure together. This method gives good mechanical support to the chip or sensor while reducing the amount of heat lost to the support structure. By using this technique, the amount of power required to heat the device to elevated temperature is vastly reduced.
申请公布号 US4596975(A) 申请公布日期 1986.06.24
申请号 US19840615999 申请日期 1984.05.31
申请人 SIERRA MONITOR CORPORATION 发明人 REDDY, PADALA K.;KHOURY, HIAM A.
分类号 G01N27/12;G01N33/00;G08B17/117 主分类号 G01N27/12
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