发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the gap made between the peripheral part of a ball and a bonding pad from corroding by a method wherein only peripheral part of ball connected to a bonding pad of pellet is coated with coating material. CONSTITUTION:The peripheral part 8 of ball 6a bonded on a bonding pad 5 is coated with coating material 8 comprising e.g. silicon gel before the part 8 is sealed with epoxy resin. Through these procedures, the gap made between the peripheral part of ball 6a and the pad 5 may be prevented from corroding.
申请公布号 JPS61101053(A) 申请公布日期 1986.05.19
申请号 JP19840222159 申请日期 1984.10.24
申请人 HITACHI LTD 发明人 OKIKAWA SUSUMU
分类号 H01L23/29;H01L23/31 主分类号 H01L23/29
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