| 摘要 |
PURPOSE:To control the flow property of sealing agent of electronic parts, by a method wherein a latent curing agent which acceralate the reaction at above 100 deg.C and a crosslinker having an amino group which cures at the temp. below 100 deg.C are compounded with prescribed volume respectively to epoxy-resin. CONSTITUTION:Boron trifluoride amine complex or imidazole 1-10pt.wt. as the latent curing agent and 20-40% of equivalence of epoxy resin either of aromatic polyamine aliphatic polyamine and polyamide amine as a crosslinker are compounded to epoxy resin 100pt.wt. When electronics parts are sealed by press and heat treating at high temperature after thin sealing agent is painted on a cover and is cured slightly at low temperature, the sealing agent will not flow out in the electronic parts or penetrating holes, besides there is no deterioration of the sealing property. |
