| 摘要 |
PURPOSE:To improve the effect of heat dissipation by mounting a heat-dissipating part on the wiring-pattern forming surface side of a semiconductor element in an insulating manner from a wiring pattern through a bonding layer. CONSTITUTION:A semiconductor element 2 is loaded onto a die pad 1 for a lead frame while interposing die adhesives 3, and inner leads 5 for the lead frame and bonding pads 6 on the element 2 are connected by small-gage wires 4 in the semiconductor element. Only the base of a heat-dissipating part 7 is attached to a liquefied epoxy resin 8, and the part 7 is stuck onto the surface of the element 2 and cured. The whole is transfer-molded with an epoxy resin 9 under the state. According to such constitution, the thermal resistance of a package can be increased largely. |
