| 发明名称 |
METHOD OF BONDING MATERIAL ON SURFACE OF SUBSTRATE |
| 摘要 |
This method involves the deposition of free metal atoms (4) from the apex (5) of a pointed tip (1) supported at a distance of 10 to 20 nm from a substrate (2). The atoms (4) are being field-desorbed under the influence of a strong electric field existing between the tip (1) and the substrate (2). With the tip (1) being moved across the substrate (2), a narrow trace (6) of metal atoms will be deposited on the substrate. |
| 申请公布号 |
JPS6115324(A) |
申请公布日期 |
1986.01.23 |
| 申请号 |
JP19850045016 |
申请日期 |
1985.03.08 |
| 申请人 |
INTERN BUSINESS MACHINES CORP |
发明人 |
GERUDO KAARU BININGU;KURISUTOFU EMANIYUERU GERUBAA;HAINRITSUHI ROORERU;EDOMONDO UEIBERU |
| 分类号 |
C23C14/22;B82B3/00;C23C14/04;C23C14/24;C23C26/00;G11B9/00;G11B9/14;H01J37/317;H01L21/203;H01L21/285 |
主分类号 |
C23C14/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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