| 摘要 |
PURPOSE:To obtain a high-speed and high-resolution contact sensor using a silicon single crystal by arranging linearly plural image sensor chips, which are subjected to high-precision cutting, to make image sensor chips long-sized. CONSTITUTION:A cut position 6 of a crystal substrate 5 where an image sensor chip is cut is protected with protective materials superior in malleability such as aluminium or the like to make high-precision cutting of the cut position 6 possible. Plural image sensor chips which are cut in high-precision cut positions 6 are arranged linearly to make image sensor chips long-sized. n-Numbers of image sensor chips 9 are arranged on a base 8 in the subscanning direction, and a proper force is applied in directions of arrows to eliminate gaps of connections parts, thus producing the high-speed and high-resolution contact sensor with single crystal silicon.
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