发明名称 Thermal recording head and process for manufacturing wiring substrate therefor.
摘要 <p>A thermal recording head comprising an insulating substrate (13) which has thereon a heat generating resistor pattern (17) made of a thin-film resistor, an electrode pattern (1 5) having a common power supply electrode pattern portion (1 5A) and a common grounded electrode pattern portion (15B), for supplying the power to the resistor pattern, and a controlling electrode pattern portion (15C), and switching elements (19) for controlling the supply of power to the resistor pattern. The electrode pattern (15) is made of a thick-film copper paste by a printing process. The operation of the switching elements is controlled by the controlling electrode pattern portion (15C).</p><p>Also disclosed is a process for manufacturing a wiring substrate for a thermal recording head.</p>
申请公布号 EP0157563(A2) 申请公布日期 1985.10.09
申请号 EP19850302032 申请日期 1985.03.25
申请人 FUJITSU LIMITED 发明人 MATSUZAKI, TOSHIO;SORIMACHI, HARUO;SATOH, KIYOSHI;SUZUKI, TAKUMI;SUGII, TAKESHI
分类号 H04N1/00;B41J2/335;(IPC1-7):H01L49/02;B41J3/04 主分类号 H04N1/00
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