| 摘要 |
<p>PURPOSE:To contrive the improvement in heat dissipation of an auxiliary semiconductor pellet and that in reliability of the titled device by having the main semiconductor pellet, a pair of electrode plates, an insulating annular member, the auxiliary semiconductor pellet, and a connection means to connect the upper electrode of this auxiliary semiconductor pellet to a required electrode of the main semiconductor pellet. CONSTITUTION:Since the main pellet 1 is sandwiched from both surfaces upper and lower with a pair of electrode plates 14 and 15 opposed to each other via thermal buffer plates 12 and 13 made of e.g. Mo or W, this pair of electrode plates 14 and 15 come into contact with the cathode electrode and the anode electrode e.g. of the main GTO formed in the main pellet 1, respectively. Besides, a step part is formed to the insulating annular member 19 supporting and fixing the electrode plates 14 and 15 along its inner periphery, and a conductor plate 30 is provided on this step part. A diode pellet is mounted on this conductor plate 30 as the auxiliary pellet. The plate 30 is connected to a lead 21 penetrating through the annular member 19, and electrically connected to a required electrode of the main pellet via lead 21.</p> |
