| 摘要 |
PURPOSE:To treat sorting and screening steps in the state coupled with a lead frame by bonding previously an insulating plate to the frame, and holding a molding body at the frame by using the plate even after cutting the leads. CONSTITUTION:A lead frame 2 having many islands 2b and leads 2a is formed, and an insulating plate 5 in which an inner frame 5 is coupled with a body 5c via a coupler 5a is formed. The frames 2 and the insulator 5 are bonded. Then, a semiconductor integrated circuit element 1 is placed on the island 2b of the frame 3, the electrodes of the element 1 are wired by fine metal wirings 3 with the leads of the frame, and molded with a resin 4. Then, the leads of the frame 2 and a molded semiconductor integrated circuit device are cut. At this time, the plate is not cut. As a result, a plurality of semiconductor integrated circuit devices are coupled with the frame 2 via the plate 5. |
