| 摘要 |
PURPOSE:To manufacture a deposited Al film having superior adhesive strength, corrosion resistance and suitability to wire bonding by forming a thin Al layer on a metallic substrate by an ionization deposition method and an Al layer on the thin Al layer by a vacuum deposition method. CONSTITUTION:A thin Al layer having superior adhesive strength is formed on a metallic substrate of Cu, a Cu alloy, an Fe-Ni alloy or the like by an ionization deposition method such as a direct current method, a high-frequency excitation method or a thermoelectron activation method. The thickness of the thin Al layer is about 5-10% of the total thickness of a multilayered Al film to be formed. An Al layer of prescribed thickness is then formed on the thin Al layer by a vacuum deposition method so as to ensure suitability to wire bonding. Thus, an easily deformable deposited Al film is obtd. A thin Al layer may be formed furthermore as finish plating by said ionization deposition method so as to improve the corrosion resistance. |
