| 摘要 |
PURPOSE:To improve the reliability and to improve the wiring characteristics of a semiconductor device by forming sealing glass or wirings through an alumina layer on a substrate made of electrically insulating silicon carbide, thereby increasing the bonding strength of the substrate with the glass. CONSTITUTION:A pellet 2 such as Si is mounted with an adhesive layer 3 on the surface at the center of a substrate 1 made of an electrically insulating silicon carbide. On the other hand, a cap 6 made of the silicon carbide is bonded through the sealing glass 4 and leads 5. The bonding pad of the pellet 2 and the inner lead of the leads 5 are electrically connected via wirings 7. In this embodiment, when the glass 4 is bonded onto the substrate 1, an alumina (alpha-Al2O3) layer 8 is formed on the substrate 1. The layer 4 is formed by coating by screen printing an alumina material on the substrate 1 and then baking at approx. 1,000 deg.C. |
